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High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

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Phoenix (suzhou) electronic Co.,ltd
City:suzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MrsMini
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High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

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Brand Name :PHOENIX
Model Number :3030
Certification :LM80 CE ROHS
Place of Origin :SUZHOU
MOQ :4000PCS
Price :Negotiation
Payment Terms :Western Union, MoneyGram, T/T
Supply Ability :800KK PER MONTH
Delivery Time :7-10 DAYS
Packaging Details :4000PCS /ROLL
Name :SMD LED 3030 white color
Application :Camera fill light
Luminous Flux(lm) :65-70lm
nput Voltage(V) :3V
Power :0.5w
Color Rendering Index(Ra) :80
Cct :10000-30000k
Warranty(Year) :2 years
Working Time (hours) :20000
Operating Temperature(℃) :-40-85
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Application Introduction:

In the electronic industry, backlight is a form of lighting, which is often used in LCD display. The difference between backlight and front light is that the backlight shines from the side or back, while the front light shines from the front as the name suggests. They are used to increase the illumination in low light source environment and the brightness on computer monitors and LCD screens to produce light in a similar way to CRT displays.

SMD LED Chip 3030 EMC 3V 6V Ultra Bright 170-180lm for high-end lighting application

Quick details:

Input Voltage(V): 3V
Warranty(Year): 2-Year
Type: Smd Led Chip 3030
Lighting solutions service: Lighting and circuitry design
Luminous Efficacy(lm/w): 160LM
Lifespan (hours): 50000
Working Time (hours): 20000
Chip Material: INGAN
Emitting Color: Warm White/Natural White/COOL WHITE
Power: 0.5W
Viewing Angle(°): 120 Degree
Color Rendering Index(Ra): 80
Color Temperature: 2700-6500K
Place of Origin: Suzhou ,jiangsu
Application: Camera fill light
Package Type: Suface Mount Package
Forward Current: 150MA
Size: 3.0*3.0*0.6mm
Packing: 4000 Pcs/Roll

Product specification:

Package Structure:

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

Absolute Maximum Ratings:

Item Symbol Absolute Maximum Ratings Unit
Forward Current IF 350 mA
Reverse Voltage Vr 8 V
Pulsed Forward Current IFP* 600 mA
Power dissipation PD 1.5 W
Operating Temperature TOP -40~85
Storage Temperature TST -40~85
Electrostatic Discharge ESD 2000(HBM) V
Junction Temperature Tj 120
LED Thermal resistance Rth s-j 30 ℃/W

Bin Structure:

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

Typical Electro-Optical characteristics curves:

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

Packaging:

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times

SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

Product features:

Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

High brightness ,low attenuation high color rendering

Minimum 70,80,90 95 CRI options

Strong welding and good stability undead light

Product series and company logo on the front

CE ROHS LM80 Certification

Production Process:

High CRI RA90 SMD 3030 LED Chip 840nm 3500k 3v 150ma

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